TSMC is to break ground on its 1.4nm fab in Taichung’s Central Taiwan Science Park on November 5th, says Taiwan’s Economic ...

Today, Chipmind, the European startup building AI agents to accelerate IC development, is launching Chipmind Agents to ...

Arm Flexible Access, the low-cost mechanism for designing on Arm, is to become available for the Armv9 edge AI platform.

Like its predecessor, it was designed from the ground up to pair well with other products in our programming ecosystem.” To protect the host system, the up-stream USB-C 2.0 is isolated (3.75kVrms ...

The Ultra ECDP (electrochemical deplating) tool is designed specifically for wide bandgap compound semiconductor ...

HyImpulse Technologies, a launch services provider, has secured an additional €30 million in financing, including raising €15 million in equity capital, as part of its Series A funding round.

Sufficient vision for reading has been restored to volunteers with ‘dry age-related macular degeneration’ in a trial of an electronic eye implant. The implant, which works with custom AR glasses and ...

In the early days of telephony, the telephone operating companies found that advertising suggestions for what to do with them ...

This early telecoms monopolist, who didn’t like the press and vice versa, hits a journo with his stick: Keep up with ...

SiC (silicon carbide) power devices are being increasingly widely adopted in electric vehicle (EV) traction drives. In tandem ...

Last year the global aviation connector market was valued at around $5.7bn, rising to $6.14bn in 2025. According to ...

Thermal interface materials (TIMs) and thermal coatings are crucial to managing the amount of heat on PCBs, and act as a ...