Abstract: Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used ...
Abstract: The rapid development of semiconductor technology has spurred demand for advanced 3-D packaging. Through-glass vias (TGVs) have emerged as a superior alternative to through-silicon vias ...
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