Abstract: A novel antenna-in-package (AiP) of a 2-D array is proposed for sub-terahertz (Sub-THz) applications at the 250–310-GHz band. The 2-D array is decomposed into several 1-D row subarrays ...
This printed product packaging—the box, the sleeve, the label, the carrier—serves as the primary interface between brand and ...
EPS for ~3-day lanes, polyurethane for higher performance, and vacuum insulation panels for maximum duration—still anchor ...
IBM's Bill Green and ISTA's Eric Hiser discuss with PW how e-commerce, automation, sustainability, and data are reshaping ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results