Abstract: Under the new demands drived by artificial intelligence and high-performance computing, 2.5D packaging has become a typical advanced packaging technology. This paper proposes a multi-scale ...
Abstract: For the type 1 short circuit behavior modeling of high voltage IGBT, Hefner model cannot effectively deal with the problems of high voltage level and current rise. In this paper, improved ...
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Mastering circuits from lab to laptop
Whether you’re in the lab soldering components or on your laptop running simulations, learning circuits is about blending theory with hands-on practice. RIT’s Circuits Studio Lab offers real-world ...
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