The AI server boom is pushing manufacturers to transform how they design and build high-performance hardware systems. Spearheading this shift are advancements in virtual simulation, which bridge the ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

GE Appliances' first in-house water filter manufacturing operation includes fully automated assembly and packaging, robotic pick-and-place systems guided by machine vision, 100 percent in-line leak ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

It can be easy to take the humble terminal block for granted. Like the steel girder on a bridge, terminal blocks provide necessary structure and stability within the electrical panel. But once they’re ...

Ford tore up the moving assembly line concept and designed a better one, the company's CEO Jim Farley explained to a crowd gathered at Louisville Assembly Plant in Kentucky for Ford's announcement ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.