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Easily Thin Silicone Sealant and Craft Your Own 3D Mold

Learn easy and budget-friendly ways to create silicone molds for all your DIY projects! From gelatin molds to resin tricks, ...
IEEE

Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package

Abstract: Microsecond UV laser drilling technology was used to form through mold vias (TMVs) with different aspect ratios, which can be applied to 3D Fan-Out Wafer Level Packaging (FOWLP). A test ...