Material properties of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack in ...

Proof of concept for a novel protection method, as an essential supplement to PERC in designs containing die-to-die IP.

The challenges of manual NoC implementation and how smart automation improves NoC performance. Today’s high-end SoCs contain ...

LLMs and other generative AI programs are a long way away from being able to design entire chips on their own from scratch, ...

That gap, the so-called memory wall, has persisted throughout most of this century, but now it is becoming more pronounced.

Modern printed circuit board assemblies (PCBAs) are designed to support increasingly complex applications in industries such ...

A new technical paper titled “Low-temperature pressure-assisted liquid-metal printing for β-Ga2O3 thin-film transistors” was ...

Models, Features and Data Representation Towards a Neural Surrogate” was published by researchers at KTH Royal Institute of ...

In this paper we will show a methodology to use PSS to orchestrate the process of HW/SW co-verification by driving UVM and C tests and controlling the interaction between them. HW/SW co-verification ...

On average, 90% of the 4,096 microhole electrodes were intracellularly coupled to neurons on top and were able to record many ...

A new technical paper titled “Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based ...

Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends” was published by researchers at Google.