ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets- FREMONT, Calif., ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Semiconductor Engineering

One Micron Damascene Redistribution for Fan-Out Wafer Level Packaging Using a Photosensitive Dielectric Material

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
Yahoo Finance

Interposer and Fan-out Wafer Level Packaging Market to Hit USD 88.77 Billion by 2032, at a CAGR of 11.86% | SNS Insider

According to the SNS Insider Report, “The Interposer and Fan-out Wafer Level Packaging Market was valued at USD 32.38 billion in 2023 and is projected to reach USD 88.77 billion by 2032, growing at a ...
EDN

Wafer-level packaging group to open line in China

SAN JOSE — A consortium of chip-equipment makers here today announced a major deal with Ace Semiconductor to help set up the world's first wafer-level packaging production line in China. Under the ...
Electronics Weekly

Semicon Europa: Low-warpage moulding for FOWLP wafer-level packaging

Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...
Semiconductor Engineering

Semiconductor Device Manufacturing Process Challenges And Opportunities

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
Nanowerk

New wafer-level MEMS packaging technology using nanoporous alumina membranes

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...
EDN

Will fan-out wafer-level packaging keep Moore’s Law valid?

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...
Digi Times

South Korea initiates major R&D project to boost chips packaging competitiveness

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...
Domain-b

DuPont, Nippon Kayaku to jointly develop wafer packaging technology

DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co Ltd and its wholly owned subsidiary, MicroChem ...