Infineon Technologies is expanding it CoolMOS CE portfolio with a SOT-223 package. This package is claimed to offer a cost effective alternative to DPAK as well as space savings in some designs. The ...

Nexperia is extending its portfolio of products in the DPAK package to cover applications from 2 A to 8 A and from 45 V up to 100 V. The nine new power bipolar transistors added to the MJD series ...

The electronics industry is shifting to compact, powerful systems. Infineon supports this trend with new 650 V CoolSiC MOSFET families in Q-DPAK and TOLL packages, driving innovation at the system ...

The Power Schottky diodes product portfolio of IXYS has extended its products in DPak (TO-252) packages and lowered power applications. The product line has six new Schottky diodes of the 2nd ...

Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon has launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were ...

Infineon is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two product families housed in Q-DPAK and TOLL packages. These families, with top- and bottom-side cooling, target high- and ...

Vishay Intertechnology, Inc. introduced a new 8 mm by 8 mm by 1.8 mm PowerPAK® 8x8L package designed to provide a high-current, space- and power-saving alternative to D²PAK and DPAK devices commonly ...

A new generation of trench MOSFETs offers high efficiency, cool running temperatures, and quality audio reproduction needed for Class D output stages. The n- and p-channel devices in the ZXM N/P 7 ...

Highly integrated GaN power ICs with autonomous EMI control and loss-less sensing are the industry’s fastest, smallest, and most efficient solution in an optimized DPAK-4L package. TORRANCE, Calif., ...

ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on silicon carbide (SiC) power semiconductor packages for applications including on-board chargers, ...