Samsung signed an MOU with Broadcom worth more than $200 billion across memory, foundry and advanced packaging for AI chips through 2030 ...

Nvidia’s $1.5 billion Amkor deal will expand US AI chip packaging capacity and could help ease a growing semiconductor supply ...

Semiconductor sovereignty is fracturing into four national chip strategies as the US, UK, EU, and India each bet on a ...

BOE Technology glass-core substrate packaging strategy, formalized July 20, 2026, bets on Corning glass and Western ...

Samsung Electronics announced it will enter into a strategic collaboration with global semiconductor design firm Broadcom ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

A groundbreaking ceremony marked the start of Phase II at the Chiayi Science Park, which is expected to produce $9.35 billion ...

The iPhone 18 Pro's A20 Pro chip is rumoured to bring a 2nm design and new packaging technology for faster AI, better performance and battery life.

Apple is upcoming iPhone 18 Pro could bring one of the biggest performance upgrades in recent years with the new A20 Pro ...