Grenoble, France. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the industry’s first ...
Leti, a research institute at CEA Tech, and Circuits Multi-Projects (CMP)are offering the world's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on ...
Capstone CS200 CMP systems from Axus Technology enable customers to realize per-wafer CoO savings of more than 50% for CMP processes on 200mm SiC wafers, compared to the closest competitor. · ...
Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
Plessey and Axus Technology, the provider of CMP, wafer thinning and wafer polishing surface-processing machines, are collaborating to bring GaN-on-Silicon monolithic microLED technology to market.
Key to the world’s best electric vehicle power trains, silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand Applied’s new 200mm CMP system ...
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